PTA facilities for
Etching tools at a glance
- 2 ICP plasma etchers
- ICP plasma deep etcher (Bosch process)
- 2 Ion beam etchers (with SIMS detection)
- 2 Wet photoresist and plasma strippers
- HF vapor etcher
- Chemical benches for wet etching
- Chemical mechanical polishing
- ICP plasma deep etcher (Bosch process)
- 2 Ion beam etchers (with SIMS detection)
- 2 Wet photoresist and plasma strippers
- HF vapor etcher
- Chemical benches for wet etching
- Chemical mechanical polishing
ICP Etcher (SI 500 324 From SENTECH)
This etching equipment (ICP ETCHER (SI 500 324 FROM SENTECH)) is dedicated to the etching of Si-CMOS compatible materials :
- Semiconductors : Si, Ge
- Oxides and nitrides : SiO2, HfO2, SiN, …
- Metals : Ta
- Carbon based material : Carbon nanotubes, graphene and resists.
- Semiconductors : Si, Ge
- Oxides and nitrides : SiO2, HfO2, SiN, …
- Metals : Ta
- Carbon based material : Carbon nanotubes, graphene and resists.
IBE etcher (scia Mill 150 from scia Systems)
The IBE (ion beam etcher) system is a scia Mill 150 from scia Systems (6 inches substrate holder, an Ar+ ion beam with end point detection system)
The IBE system enables thin film etching of many materials (metal, magnetic materials,…) and multi layers stacks.
The IBE system enables thin film etching of many materials (metal, magnetic materials,…) and multi layers stacks.
Microwave STRIPPER (Pico µW PCCE 7 from DIENER)
Pico µW PCCE 7 from DIENER is a tool dedicated to photoresists and polymers stripping.
HF vapour phase etcher (Primaxx Monarch3 from SPTS)
The Primaxx Monarch 3 System is a single process module tool for controlled HF vapor phase etching.
The Primaxx Monarch 3 Module performs a vapor phase; selective, isotropic etch on sacrificial SiO2 to “release” membranes or other structures.
The Primaxx Monarch 3 Module performs a vapor phase; selective, isotropic etch on sacrificial SiO2 to “release” membranes or other structures.
HDRF Stripper (DSB9000M from Plasma-Therm)
DSB9000M is a tool dedicated to photoresists and polymers stripping with high strip rate (> 1µm/min).
Etching : Deep RIE SPTS (SPX HRM 180)
The SPX HRM 180 is an ICP plasma etcher (for Inductively Coupled Plasma).
This etching tool is dedicated to the deep reactive ion etching (DRIE) of Silicon using the BOSCH process
This etching tool is dedicated to the deep reactive ion etching (DRIE) of Silicon using the BOSCH process
ICP Etcher (Plasmalab100 from Oxford)
The plasmalab 100 is an ICP plasma etcher (for Inductively Coupled Plasma).
This etching toool is dedicated to the etching of semiconductor (Si, Ge…), oxide ( SiO2, HfO2, SiN…), III-V materials (InP, AsGa, GaN,..), metal (Ti, Ta…) an organic materials using halogen (Br, F, Cl) or oxygen based plasmas
This etching toool is dedicated to the etching of semiconductor (Si, Ge…), oxide ( SiO2, HfO2, SiN…), III-V materials (InP, AsGa, GaN,..), metal (Ti, Ta…) an organic materials using halogen (Br, F, Cl) or oxygen based plasmas
Etching : IBE 01 Plassys (MU400 from Plassys)
The IBE (ion beam etcher) system is a MU400 from Plassys (4 inches substrate holder, an Ar+ ion beam with end point detection system)
The IBE system enables thin film etching of many materials (metal, magnetic materials,…) and multi layers stacks.
The IBE system enables thin film etching of many materials (metal, magnetic materials,…) and multi layers stacks.
Etching : ICP STS (STS multiplex from SPTS)
The STS multiplex is an ICP plasma etcher (for Inductively Coupled Plasma).
This etching equipmenttool is dedicated to the etching of semiconductor (Si, Ge…) and oxide ( SiO2, SiN…), some metal (Ti, Ta…) an organic materials using fluorine or oxygen based plasmas
This etching equipmenttool is dedicated to the etching of semiconductor (Si, Ge…) and oxide ( SiO2, SiN…), some metal (Ti, Ta…) an organic materials using fluorine or oxygen based plasmas