MP700S is a sputtering tool enabling thin film deposition with thicknesses up to several hundred of nanometers. 5 targets availables : Ti, Cr, Au, Ta, W, Cu.

- Metal evaporators
- ALD tool (Oxide and metal)
- PECVD tool (SiN, SiO2 and amorphous silicon)
- PVD tools (metal and oxide)
- LPCVD tool (polysilicon and SiN)

CT100 tool is a two-chamber sputtering system enabling thin film deposition with thicknesses up to several hundred of nanometers. Deposition of metals and oxides : Al, Cr, Ti, Nb, Ta, NbN, TiN, AlN, NiFe (81/19 and 36/64), SiO2, Si3N4, ITO.

Thin film metal deposition tool (up to several hundred of nm)
Deposition made by evaporation using an electron gun
metals availlable : Ti, Cr, Al, Au, Ni, Pt, Ge, Pd, Nb, V, NiFe (81/19), NiCr(80/20), Co, CoFe (60/40), Cu, Ag, Sn, Ta

Plasma Enhanced Chimical Vapor Depositon (PECVD) is a tool from Corial to deposit SiN, SiO2 and amorphous (from 50 nm to 2µm)

Low Pressure Chemical Vapor Deposition (PECVD) is an tool from Tempress to deposit SiN and polysilicon (from 50 nm to 200 nm)

The Fiji 200 is an ALD equipment(Atomic Layer deposition) assisted or not by a remote plasma (O2, N2 and H2)
Deposition of thin and conformal layers (HfO2, Al2O3, TiO2, TiN, ZnO, AZO,..)

Technical characteristics RTA system is an equipment for rapid thermal annealing. Annealings are made from 100°C up to 1000°C and it is design for rapid process typical duration: short ramp time to reach high temperature […]