Back End : CMP Alpsitec (E460C from Alpsitec)

Technical description:

Surface polishing and surface planarization

Sample size : 2" wafer and 4” wafer or sample 10x10mm² (specific carrier wafer or sample)

Manual control of  recipe parameters

Manual substrate loading

Process capabilities:

Polishing or planirization of oxide (SiO2,SiN,..) or metal (Al,..) with specific slurries

Contact: thierry.chevolleau@cea.fr